After spending 7 years managing an engineering organization that designs Sun’s CPU LGA (Land Grid Array) socket, I have accumulated lots of hands-on knowledge about this LGA mechanical “beast.” It’s a “beast” because it has some interesting behaviors that are difficult to predict due to its “system” nature, encompassing the contacts, CPU package, socket frame, heatsink attach, PCB and etc. The following IEEE article that I co-authored with the scholars from CALC of University of Maryland is a good manifestation of the knowledge.
